Electronics and semiconductor cooling

Chillers for semiconductor manfacturing

Semiconductor wafers must be shaped with absolute accuracy, using a process called “dry etching.” During the etching process, the wafers are securely held in place by the electrostatic chuck (ESC), which functions as the platform on which they rest. Because the ESC is in direct contact with the wafer, any temperature fluctuations there can significantly impact the etch rate in the chamber, compromising the uniformity of the features etched onto it. Inconsistent etch rates may in turn lead to changes in critical dimensions (CDs), ultimately affecting the quality of the semiconductors.